电子封装技术专业本科培养计划

Undergraduate Program for Specialty in Electronics Packaging Technology

一、培养目标

Ⅰ. Program Objective

本专业培养系统掌握电子制造科学与工程领域的基础理论及工程应用知识，能够从事集成电路制造、电子封装技术、电子制造装备及电子工艺材料等领域的科学研究、技术开发、设计制造、企业管理等工作，具有国际视野以及适应社会经济发展需求的、富有创新精神的高素质复合型人才。毕业后，经过努力和磨练，能够逐渐成长为社会的领军人才。

This program is aimed to cultivate students with the basic theory and applied knowledge of electronic manufacturing science and engineering, and can engage in the scientific research, technology development, design and manufacturing, enterprise management of integrated circuit manufacture, electronic packaging, electronic manufacturing equipments and electronic technology materials. High-quality, innovative and highly-qualified compound talents who can meet the needs of social and economic development. After graduation, through hard work and training, the students can gradually grow into a leading figure in society.

二、基本规格要求

Ⅱ. Learning Outcomes

本专业主要学习电子制造科学与工程和材料工程两个领域的基础理论和应用技术，毕业生应获得如下几个方面的知识和能力：

（1）能够将数学、自然科学、工程基础和专业知识用于解决复杂工程问题。

（2）能够应用数学、自然科学和工程科学的基本原理，识别、表达、并通过文献研究分析复杂工程问题，以获得有效结论。

（3）能够设计针对复杂电子制造工程问题的解决方案，设计满足特定需求的系统、单元（部件）或工艺流程，并能够在设计环节中体现创新意识，考虑法律、健康、安全、文化、社会以及环境等因素。

（4）能够基于科学原理并采用科学方法对复杂电子制造工程问题进行研究，包括设计实验、分析与解释数据、并通过信息综合得到合理有效的结论。

（5）能够针对复杂电子制造工程问题，开发、选择与使用恰当的技术、资源、现代工程工具和信息技术工具，包括对复杂工程问题的预测与模拟，并能够理解其局限性。

（6）能够基于工程相关背景知识进行合理分析，评价电子制造工程实践和复杂电子制造工程问题解决方案对社会、健康、安全、法律以及文化的影响，并理解应承担的责任。

（7）能够理解和评价针对复杂电子制造工程问题的工程实践对环境、社会可持续发展的影响。

（8）具有人文社会科学素养、社会责任感，能够在工程实践中理解并遵守工程职业道德和规范，履行责任。

（9）能够在多学科背景下的团队中承担个体、团队成员以及负责人的角色。

（10）能够就复杂工程问题与业界同行及社会公众进行有效沟通和交流，包括撰写报告和设计文稿、陈述发言、清晰表达或回应指令。并具备一定的国际视野，能够在跨文化背景下进行沟通和交流。

（11）理解并掌握工程管理原理与经济决策方法，并能在多学科环境中应用。

（12）具有自主学习和终身学习的意识，有不断学习和适应发展的能力。

As a student of this program, you will gain：

(1) Able to apply knowledge of mathematics, natural science, engineering fundamentals and expertise to solve complex engineering problems.

(2) Identify, formulate, research on literature and analysis complex engineering problems to reach substantiated conclusions using basic principles of mathematics, natural sciences and engineering sciences.

(3) Find solutions for complex electronic manufacturing engineering problems and design innovative systems, units (components) or processes that meet specific requirements. The solution and design shall factor in legal, health, safety, culture, society, and environmental perspectives.

(4) Conduct investigations of complex electronic manufacturing engineering problems using research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of information to obtain reasonable and effective conclusions.

(5) Create, select and apply appropriate techniques, resources, and modern engineering and information analytical tools for complex electronic manufacturing engineering problems, including prediction and simulation of complex engineering problems, and understand their limitations.

(6) Assess appropriately on societal, health, safety, legal and cultural impact and the consequent responsibilities relevant to professional engineering practice and solutions to complex electronic manufacturing engineering problems.

(7) Understand and evaluate the impact of engineering practice on complex electronic manufacturing engineering problems on environmental and social sustainable development.

(8) Apply ethical principles and commit to professional ethics and responsibilities and norms of engineering practice.

(9) Ability to assume the role of individual, team members, and principals in a multidisciplinary team.

(10) Communicate effectively on complex engineering activities with the engineering community and with society at large, such as being able to comprehend and write reports and documentation, make effective presentations, and give and receive clear instructions. Possess a certain degree of global outlook, and be able to communicate across different cultures.

(11) Obtain knowledge and understanding of engineering management principles and economic decision-making, and apply these to work.

(12) Recognize the demand, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change.

三、培养特色

Ⅲ. Program Highlights

电子制造工程与材料工程相结合，理论与实际相结合，基础知识与学科前沿相结合。

This program emphasizes on the combination of electronic manufacturing engineering and materials engineering, theory and practice, as well as the basic knowledge and the latest discipline knowledge.

四、主干学科

Ⅳ. Main Disciplines

电子制造科学与工程 Electronic manufacturing Science and Engineering

五、学制与学位

Ⅴ. Program Length and Degree

学制：四年

Duration：4 years

授予学位：工学学士

Degrees Conferred：Bachelor of Engineering

六、学时与学分

Ⅵ. Credits Hours and Units

完成学业最低课内学分（含课程体系与集中性实践教学环节）要求：160学分

Minimum Credits of Curricular (Comprising course system and intensified internship practical training)：160 credits.

其中，专业基础课程、专业核心课程学分不允许用其他课程学分进行学分冲抵和替代。

Major-related basic courses and core courses cannot be covered using credits from other courses in this program.

完成学业最低课外学分要求：5学分

Minimum Extracurricular Credits：5 credits

1. 课程体系学时与学分

Course Credits Hours and Units

2. 集中性实践教学环节周数与学分

Practicum Credits

续表

3. 课外学分

Extracurricular Credits

注：参加校体育运动会获第一名、第二名者与校级一等奖等同，获第三名至第五名者与校级二等奖等同，获第六至第八名者与校级三等奖等同。

Note: In HUST Sports Meeting, the first and the second prize, the third to the fifth prize, and the sixth prize to the eighth prize are deemed respectively the first prize, the second prize and the third prize of university level.

七、主要课程及创新（创业）课程

Ⅶ. Main courses and Innovation (Entrepreneurship) course

微连接原理Fundamentals of Micro-joining、电子制造技术基础 Fundamentals of Electronic manufacturing Technology、半导体工艺技术Semiconductor Manufacturing、电子工艺材料Materials for Electronic Manufacturing、印刷线路板设计Design of Printed Circuit Board、电子制造可靠性与失效分析Reliability and Failure Analysis for Electronic Manufacturing、工程化学Engineering Chemistry、工程力学Engineering Mechanics、材料科学基础Fundamentals of Materials Science、固体电子学基础Fundamentals of Solid Electronics、材料专业创新创业导论Introduction to innovation and entrepreneurship in Materials Science。

八、主要集中性实践教学环节（含专业实验）

Ⅷ．practicum module（experiments included）

军事训练Military Training、工程训练 Engineering Practice、电子制造工程训练Engineering Training of Electronic Manufacturing、专业社会实践Professional Social Practice、生产实习Engineering Internship、专业课程设计Course Project、毕业设计（论文）Undergraduate Thesis。

九、教学计划进程表

Ⅸ．Course Schedule

院（系）：材料科学与工程学院 专业：电子封装技术

School(Department): School of Materials Science and Engineering Specialty: Electronic Packaging Technology