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电子封装技术(2014级)

发布时间:2018-05-31 编辑:宋登望 来源: 浏览次数:

电子封装技术专业本科培养计划

Undergraduate Program for Specialty in Electronics Packaging Technology

一、培养目标

Ⅰ.program objective

本专业培养具备材料科学与工程学科、电子制造学科以及信息学科有关的基础理论知识与应用能力,能够从事电子制造与电子材料等应用领域的科学研究、教学、技术开发、设计制造、试验研究、企业管理和经营等方面工作,适应市场经济发展的富有创新精神的高素质复合型人才。特别针对电子制造业培养急需的专门人才。

This program prepares students a thorough knowledge in materialscienceandengineering, electronics manufacturing technology and information sciences. With skills of combiningelectronics materials andmanufacturing, students will be competent to do research, development, teaching and management jobs.

二、基本规格要求

Ⅱ.learning outcomes

本专业主要学习材料工程及电子制造科学与技术两个领域的基础理论和应用技术,毕业生应获得如下几个方面的知识和能力:

1.具有较为扎实的自然科学基础,较好的人文、艺术和社会科学基础及素质;

2.系统掌握微电子与材料工程领域的宽广的理论基础知识和应用技术,主要包括力学、机械学、电工与电子技术、固体电子学、材料学、材料加工工程等;

3.系统学习电子制造专业领域的理论基础知识和应用技术,主要包括电子制造技术基础、半导体工艺技术、电子封装与组装技术、电子工艺材料与设备、电子产品可靠性等;

4.具有电子制造专业所需的编程、分析、实验、测试、文献检索等基本技能;

5.熟悉本专业领域各个方向的专业技术,了解学科的前沿及发展趋势;

6.具有较好的外语能力、自学能力、富有创新精神,具备较高综合素质。

As a student of this program, you will gain:

1.Solid grounding in both natural sciences and humanities & arts;

2.Excellent basic training inelectronics,materials engineering;

3.Skills of electronics manufacturing, semiconductor processing, electronicpackaging andassembling technology, electronic materials and equipments, and electronic products reliability;

4.Skills of programming, analyzing, experimenting, testing, and data researching in electronic manufacturing;

5.Knowledge of two or three specializations of the subject matter in electronics manufacturing and material processing related areas, and understanding of its trend and current stage of development;

6.Mastery of a foreign language and Self-learning ability and innovative thinking.

三、培养特色

Ⅲ.program highlights

材料工程与电子制造技术相结合,拓宽专业方向,使培养的毕业生更加适应社会

This program integrates the knowledge ofmaterialengineering with that of electronic manufacturing. It also broadens its specialty field in order to produce visible graduates who are more adaptable to the society.

四、主干学科

Ⅳ.Major Disciplines

电子制造技术Electronicmanufacturing technology

五、学制与学位

Ⅴ.program length and degree

修业年限:四年

Duration:4 years

授予学位:工学学士

Degrees Conferred:Bachelor of Engineering

六、学时与学分

Ⅵ.credits hours and units

完成学业最低课内学分(含课程体系与集中性实践教学环节)要求:163

Minimum Credits of Curricular(Comprising course system and intensified internship practical training):192.5

完成学业最低课外学分要求:5

Minimum Extracurricular Credits:5

1.课程体系学时与学分

course credits hours and units

课程类别

课程性质

学时/学分

占课程体系学分比例(%)

通识教育基础课程

必修

1032/58.5

39.8

选修

160/10

6.8

学科专业基础课程

必修

944/57

38.8

专业课程

专业核心课程

必修

160/8.5

5.8

专业方向课程

选修

208/13

8.8

合计

2504/147

100

Course Classified

Course Nature

Hrs/Crs

Percentage (%)

General Education Core Curriculum

required

1032/58.5

39.8

Elective

160/10

6.8

Basic Sub-disciplinary Courses

required

944/57

38.8

Courses in Specialty

Major-specific Core Courses

required

160/8.5

5.8

Major-specific Electives

Elective

208/13

8.8

Total

2504/147

100




2.集中性实践教学环节周数与学分

practicum credits

实践教学环节名称

课程性质

周数/学分

占实践教学环节学分比例(%)

军事训练

必修

2/1

6.3

公益劳动

必修

1/0.5

3.1

金工实习

必修

4/2

12.4

电工实习

必修

2/1

6.3

专业社会实践

必修

1/0.5

3.1

生产实习

必修

3/1.5

9.4

专业课程设计

必修

3/1.5

9.4

毕业设计(论文)

必修

16/8

50

合计

32/16

100

Internship & Practical Training

Course Nature

Weeks/Credits

Percentage (%)

Military Training

Required

2/1

6.3

Laboring for Public Benefit

Required

1/0.5

3.1

Mechanical Engineering Training

Required

4/2

12.4

Electrical Engineering Practice

Required

2/1

6.3

Professional Social Practice

Required

1/0.5

3.1

Engineering Internship

Required

3/1.5

9.4

Course Project

Required

3/1.5

9.4

Undergraduate Thesis

Required

16/8

50

Total

32/16

100

3.课外学分

extracurricular credits

序号

课外活动名称

课外活动和社会实践的要求

课外学分

1

社会实践活动

提交社会调查报告,通过答辩者

1

个人被校团委或团省委评为社会实践活动积极分子者,集体被校团委或团省委评为优秀社会实践队者

2

2

英语及计算机

考试

全国大学英语六级考试

考试成绩达到学校要求者

2

托福考试

达90分以上者

3

雅思考试

达6.5分以上者

3

GRE考试

达1350分以上者

3

全国计算机等级考试

获二级以上证书者

2

全国计算机软件资格、水平考试

获程序员证书者

2

获高级程序员证书者

3

获系统分析员证书者

4

3

竞赛

校级

获一等奖者

3

获二等奖者

2

获三等奖者

1

省级

获一等奖者

4

获二等奖者

3

获三等奖者

2

全国

获一等奖者

6

获二等奖者

4

获三等奖者

3

4

论文

在全国性刊物发表论文

每篇论文

2~3

5

科研

视参与科研时间与科研能力

每项

1~3

6

实验

视创新情况

每项

1~3

注:参加校体育运动会获第一名、第二名者与校级一等奖等同,获第三名至第五名者与校级二等奖等同,获第六至第八名者与校级三等奖等同。

No.

Extracurricular Activities and Social Practice

Requirements

Extracurricular

Credits

1

Activities of Social Practice

Submit report and pass oral defense

1

Entitled as Activistby the Communist Youth League of HUST or Hubei Province;

Membership of the group which is entitled as Excellent Social Practice Group by the Communist Youth League of HUST or Hubei Province

2

2

Examinations in English and Computer

CET-6

Students whose Band-6 exam scores accord our requirements

2

TOEFL

90 Points or Higher

3

IELTS

6.5 Points or Higher

3

GRE

1350 Points or Higher

3

National Computer Rank Examination

Win certificate of Band-2 or higher

2

National ComputerSoftwareQualification

Win certificate of programmer

2

Win certificate of Advanced Programmer

3

Win certificate of System Analyst

4

3

Competitions

University Level

Win first prize

3

Win second prize

2

Winthird prize

1

Provincial Level

Win first prize

4

Win second prize

3

Winthird prize

2

National Level

Win first prize

6

Win second prize

4

Winthird prize

3

4

Thesis

Those whose thesis appears in national publications

Per piece

2~3

5

Scientific Research

Depending on both the time spent in and ability demonstrated in scientific research project

Each item

1~3

6

Experiments

Depending on innovative extent

Each item

1~3

Note: In HUST Sports Meeting, the first and the second prize, the third to the fifth prize, and the sixth prize to theeighthprize are deemed respectively the first prize, the second prize and the third prize of university level.

七、主要课程

Ⅶ.main courses

工程化学Engineering Chemistry、工程力学Engineering Mechanics、材料科学基础Fundamentals of Materials Science、固体电子学基础Fundamentals of Solid Electronics、微连接原理Fundamentals of Micro-joining、电子制造技术基础Fundamental of Electronics Manufacturing Technology、半导体工艺技术Semiconductor Manufacturing、电子工艺材料Materials for Electronic Manufacturing、印刷线路板设计Design of Printed Circuit Board、电子制造可靠性与失效分析Reliabilityand Failure Analysisfor Electronic Manufacturing。

八、主要实践教学环节(含专业实验)

Ⅷ.practicum module(experiments included)

军事训练MilitaryTraining,金工实习Industrial Practice,电工实习Electrical Engineering Practice,机械基础工程训练Mechanical Engineering Training,专业社会实践Professional Social Practice,生产实习Engineering Internship,专业课程设计Course Project,毕业设计(论文)Undergraduate Thesis。

九、教学计划进程表

Ⅸ.Course Schedule

院(系):材料科学与工程学院 专业:电子封装技术

School(Department): School of Material Science and Engineering Soecity: Electronic Packaging Technology

课程类别course type

课程性质

required / elective

课程代码

course code

课程名称(中文/英文)

course name

学时

hrs

学分

crs

其中

设置学期

semester

课外

extra

-cur.

实验

exp.

上机

operation

通识教育基础课程General Education Core Curriculum

必修

required

0301902

思想道德修养与法律基础 Morals & Ethics & Fundamentals of Law

40

2.5

8



1

必修

required

0100721

中国近现代史纲要

Survey of Modern Chinese History

32

2

8



2

必修

required

0100932

思政课社会实践

Social Practice of Ideological and Political Theories Course

24

1.5

20



2

必修

required

0100733

马克思主义基本原理

Basic Theory of Marxism

40

2.5

8



3

必修

required

0100322

毛泽东思想和中国特色社会主义理论体系概论General Introduction to Mao Zedong Thought and Socialist Theory with Chinese Characteristics

56

3.5




4

必修

required

0100741

形势与政策

Current Affairs and Policy

32

2

14



1~6

必修

required

0510071

中国语文

Chinese

32

2

10



1

必修

required

1100011

军事理论 Military Theory

16

1




1

必修

required

0508453

综合英语(一) Comprehensivel English (Ⅰ)

56

3.5




1

必修

required

0508463

综合英语(二) Comprehensive English (Ⅱ)

56

3.5




2

必修

required

0700011

微积分(一)上

Calculus (Ⅰ)

88

5.5




1

必修

required

0700012

微积分(一)下

Calculus (Ⅱ)

88

5.5




2

必修

required

0700051

线性代数(一)

Linear Algebra (Ⅰ)

40

2.5




2

必修

required

0700071

复变函数与积分变换

Complex Function and Integral Transform

40

2.5




3

必修

required

0700063

概率论与数理统计(三)

Probability and Mathematics Statistic (Ⅲ)

40

2.5




3

必修

required

0700048

大学物理(一)

Physics (Ⅰ)

64

4




2

必修

required

0700049

大学物理(二)

Physics (Ⅱ)

64

4




3

必修

required

0706891

物理实验(一)

Physical Experiments (Ⅰ)

32

1


32


2

必修

required

0706901

物理实验(二)

Physical Experiments (Ⅱ)

24

0.75


24


3

必修

required

0400111

大学体育(一)

Physical Education(Ⅰ)

32

1




1

必修

required

0400121

大学体育(二)

Physical Education(Ⅱ)

32

1




2

必修

required

0400131

大学体育(三)

Physical Education(Ⅲ)

32

1




3

必修

required

0400141

大学体育(四)

Physical Education(Ⅳ)

32

1




4

必修

required

0827781

计算机与程序设计基础(C++)

48

3



8

1


选修

Elective


人文社科类选修课程(指定选修艺术类课程2学分)Elective Electives in the Humanities

160

10





学科专业基础课程 Basic Sub-disciplinary Courses

必修

required

0400022

学科(专业)概论 An Introduction to Discipline (Specialty)

16

1




1

必修

required

0800463

工程制图(三)上

Engineering Graphics (Ⅲ)

40

2.5




1

必修

required

0800462

工程制图(三)下

Engineering Graphics (Ⅲ)

32

2




2

必修

required

0701814

工程化学

Engineering Chemistry

40

2.5




3

必修

required

0800118

电路理论

Electrical & Magnetic Circuits

40

2.5


6


3

必修

required

0828171

数据结构及数据库 Database System Technology and Applications

32

2



8

3

必修

required

0800052

工程力学(二)

Engineering Mechanics(Ⅱ)

72

4.5


6


3

必修

required

0827492

电子制造技术基础

Fundamental of Electronic Manufacturing Technology

40

2.5




3

必修

required

0800123

模拟电子技术(三)

Analogue Electronics (Ⅲ)

40

2.5


6


4

必修

required

0800096

机械原理

Theory of Machines and Mechanisms

32

2


4


4

必修

required

0800365

机械制造技术基础

Foundation of Mechanical Manufacture

40

2.5


4


4

必修

required

0801136

材料科学基础

Fundamentals of Material Science

64

4




4

必修

required

0801144

材料科学基础实验

Experiment of Material Science

8

0.25




4

必修

required

0808184

固体电子学基础(一)

Fundamentals of Solid Electronics (Ⅰ)

64

4




4

必修

required

0817971

微电子学概论

Foundation of Microelectronics

32

2




4

必修

required

0812301

工程传热学(一)

Heat Transfer (Ⅰ)

32

2


2


5

必修

required

0800455

信号与系统

Signal and System

56

3.5


8


5

必修

required

0809991

数字电路

Digital Circuit

32

2




5

必修

required

0800305

微机原理

Principle of Microcomputer

32

2



10

5

必修

required

0807632

电子测试与实验技术

Electronic Testing and Experiment Techniques

56

1.75




5

必修

required

0827501

微连接原理

Foundation of Micro-joining

40

2.5




5

必修

required

0809554

材料成型理论基础

Foundation of Material Forming Theory

56

3.5




5

必修

required

0828181

材料物理与力学性能

Physical and Mechanical Properties of Materials

40

2.5




6

专业核心课程Major-specific Core Courses

必修

required

0811201

半导体工艺技术

Semiconductor Manufacturing

32

2




5

必修

required

0842421

印刷线路板设计

Design of Printed Circuit Board

32

2



16

5

必修

required

0817995

电子封装技术工艺综合实验

Comprehensive Experiment on Electronic Packaging Technology

16

0.5




5

必修

required

0827512

电子工艺材料

Materials for Electronic Manufacturing

32

2




6

必修

required

0827533

电子产品组装与可靠性综合实验

Comprehensive Experiment on Electronic Assembly Technology and Reliability

16

0.5


16


6

必修

required

0832561

电子制造可靠性与失效分析

Reliability and Failure Analysis for Electronic Manufacturing

32

2




6


选修

Elective


专业选修课程

Electives in Specialty-oriented

232

14.5





专业方向课程 Major-specific Electives

选修

Elective

0800916

CAD技术基础 Foundation of CAD Technology

32

2



16

5

选修

Elective

0835903

有限元基础

FE Foundation of Materials Forming

24

1.5




6

选修

Elective

0801401

材料表面工程

Surface Engineering of Materials

32

2




6

选修

Elective

0832951

管理与工业工程

Management and Industrial Engineering

32

2




6

选修

Elective

0809612

激光加工技术

Laser Processing Technology

24

1.5




6

选修

Elective

0827563

电子组装技术

Electronic Assembly technology

24

1.5




6

选修

Elective

0827572

先进基板技术

Advanced Substrate Technology

24

1.5




6

选修

Elective

0818641

电子封装模拟技术

Simulation for Electronic Packaging

24

1.5




6

选修

Elective

0842431

电子封装结构与设计

Structure and Design for Electronic Packaging

24

1.5




6

选修

Elective

0828191

电子设计与应用

Electronic Design and Application

32

2


8


6

选修

Elective

0841841

接插件技术

Connector Technology

24

1.5




6

选修

Elective

0813682

光电子器件导论

Introduction of Photo-electronic Device

24

1.5




7

选修

Elective

0804872

电子显示技术

Electronic Display Technology

24

1.5




7

选修

Elective

0827582

电子工业专用设备

Equipment of Electronic Manufacturing

24

1.5




7

选修

Elective

0827522

MEMS封装技术

MEMS Packaging Technology

24

1.5




7

选修

Elective

0827542

生物芯片技术

Bio-Chip Technology

24

1.5




7

选修

Elective

0842091

冲压工艺与模具设计

Sheet Metal Forming Technology and Die Design

32

2




7

选修

Elective

0817862

塑料成形工艺与模具设计

Plastics Processing and Die Design

32

2




7

选修

Elective

0818651

汽车电子

Auto Electronics

24

1.5




7

选修

Elective

0818661

半导体照明

Semiconductor lighting

24

1.5




7

选修

Elective

0817961

光伏电子

Photovoltaic Electronics

24

1.5




7

实践环节 practical training items

必修

required

1300013

军事训练

Military Training

2w

1




1

必修

required

1302333

金工实习

Industrial Practice

4w

2




3

必修

required

1304411

电工实习

Electrical Engineering Practice

2w

1




4

必修

required

1300486

专业社会实践

Professional Social Practice

1w

0.5




4

必修

required

130008a

生产实习

Engineering Internship

3w

1.5




6

必修

required

1300024

公益劳动

Labouring for Public Benefit

1w

0.5




7

必修

required

1325025

专业课程设计

Course Project

3w

1.5




7

必修

required

130004a

毕业设计(论文)

Undergraduate Thesis

16w

8




8